Oblon is Gold Sponsor for LESI 2019 Annual Conference
Oblon is a Gold sponsor of the LESI 2019 Annual Conference that will take place on May 26-28, 2019 in Yokohama Japan.
LES International (LESI) is a global business association representing more than 10,000 Intellectual Property professionals covering over 90+ countries. “LESI Annual Conferences are incredible networking and learning environments that cover multiple industries and sectors.” said Dr. Yorikatsu Hohokabe, CLP, Senior Advisor at Oblon and LES Japan vice-president. “It is an ideal opportunity to meet IP professionals from different parts of the world, and to continue to show our commitment to our presence in Japan, where our Tokyo office is located,” said Dr. Philippe Signore, Managing Partner.