SOONWUK CHEONG, Ph.D., is a materials science patent agent in Oblon, Spivak’s Chemical Patent Prosecution group. Dr. Cheong prepares and prosecutes patent applications, focusing on various aspects of materials science, including structural/electromagnetic materials, physical/process metallurgy, crystallography, and computational materials science. He has authored and co-authored many publications in peer-reviewed journals such as the Journal of Applied Physics and Acta Materialia.
Prior to joining the firm, Dr. Cheong worked as a research scientist at Alcoa Inc., where he managed projects in aerospace, electronic packaging, data storage and solar technology. He also worked with NASA in the Ares Launch Vehicles Program.
Dr. Cheong was a visiting scholar at Wright Patterson Air Force Research Lab (AFRL) where he worked on a microstructure simulation project using Monte Carlo Method.
His scientific articles include:
“A crack model for the onset of blisters using finite surface thickness”, J.W. Hong, S.W. Cheong, Journal of Applied Physics, 100, 1, 2006 (Also, selected by Virtual Journal of Nanoscale Science & Technology, Nov. 27, 2006).
“Effect of temper rolling on texture formation in a Low Loss Cold-Rolled Motor Lamination Steel”, S.W. Cheong, E. Hilinski, A.D. Rollett Metall. Trans. A, Vol.34, No. 6, pp.1321-1327, 2003.
“Texture analysis of twinning and slip in polycrystalline Ti-46.3Al-1.9Nb-1.6Cr in compression at room temperature and elevated temperatures”, S.W. Cheong, J.D. Sadowitz, T.R. Bieler Scripta Metall., Vol. 35, No. 5, 661-667, 1996.
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