GREG H. GARDELLA is a partner in the firm's Post Grant Patent Practice Group. Mr. Gardella is known for handling many of the highest stakes post-grant matters ever adjudicated by the United States Patent and Trademark Office. He regularly serves as lead counsel for both challengers and patent owners in matters having stakes running into the billions of dollars. As of June 2013 he was lead counsel on more AIA post-grant proceedings pending before the Patent Trial and Appeal Board than any other practitioner in the United States.
Mr. Gardella has been honored as one of the Best Lawyers in America for multiple consecutive years. He also has been named repeatedly by Intellectual Asset Management (IAM) as one of the nation’s top post-grant practitioners. In its latest rankings IAM reported that “the ‘phenomenal’ Greg H Gardella is ‘extremely experienced in the post-grant space and a dynamic all-round patent consultant.’” The previous version of the rankings noted that his “former big-ticket patent litigation experience has served him well in contested reexamination proceedings, of which he is regarded a master.” He likewise has received various awards and recognition from The Legal 500, Managing IP Magazine and Super Lawyers.
Prior to joining Oblon Spivak, Mr. Gardella was a partner at Irell & Manella, LLP. While there, he chaired the Reexamination Practice Group and oversaw the training of lawyers and patent agents related to Patent Office proceedings.
Mr. Gardella has substantial education and experience in the following technical areas: semiconductor fabrication and device structure (e.g. vapor deposition, etch, patterning, spin-on coatings, implant, epitaxy, LEDs, power MOSFETs, solar cells, LCDs), computer architecture (e.g. superscalar uPs, graphics/memory controllers, I/O controllers, adapters, bridges, DMA, cache coherency, power management), wireless telecommunications (e.g. GSM, IS-95/54, GPRS and 3G standards, including WCDMA, CDMA-2000, and UMTS; security protocols; vocoding; bridging; duplexing), network data communication (e.g. Bluetooth and other wireless protocols, access control, routing, ATM, enterprise platforms, ASPs, VPNs), software ranging from microcode to application layer (e.g. middleware, OS, SSL, drivers, application layer suites, environments including C, C++, Java, XML, HTML, TEK, Perl, HDLs), medical devices (e.g. implantable devices, surgical devices, automated pharmacy systems, defibrillators, spinal implants, slow release implants, endoscopic devices), signal processing, embedded controllers, VLSI design, microstructured films, and various types of industrial equipment.